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ICs, ट्रांजिस्टर के लिए सॉकेट

निर्माता भाग संख्या	उपलब्धता	मूल्य	मात्रा	डेटाशीत	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
01-0518-11 CONN SOCKET SIP 1POS GOLD Aries Electronics	3,390	-	RFQ	डेटाशीत	Bulk	518	Active	SIP	1 (1 x 1)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-10 CONN SOCKET SIP 2POS GOLD Aries Electronics	2,429	-	RFQ	डेटाशीत	Bulk	518	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	3,252	-	RFQ	डेटाशीत	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
01-0513-11 CONN SOCKET SIP 1POS GOLD Aries Electronics	2,850	-	RFQ	डेटाशीत	Bulk	0513	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-00 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	3,168	-	RFQ	डेटाशीत	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-0513-10T CONN SOCKET SIP 2POS GOLD Aries Electronics	2,297	-	RFQ	डेटाशीत	Bulk	0513	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-10H CONN SOCKET SIP 2POS GOLD Aries Electronics	2,709	-	RFQ	डेटाशीत	Bulk	518	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-10T CONN SOCKET SIP 2POS GOLD Aries Electronics	2,654	-	RFQ	डेटाशीत	Bulk	518	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10H CONN IC DIP SOCKET 2POS GOLD Aries Electronics	3,145	-	RFQ	डेटाशीत	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10T CONN IC DIP SOCKET 2POS GOLD Aries Electronics	3,764	-	RFQ	डेटाशीत	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
01-0513-10H CONN SOCKET SIP 1POS GOLD Aries Electronics	2,468	-	RFQ	डेटाशीत	Bulk	0513	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-0513-10 CONN SOCKET SIP 2POS GOLD Aries Electronics	2,984	-	RFQ	डेटाशीत	Bulk	0513	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
03-0513-10H CONN SOCKET SIP 3POS GOLD Aries Electronics	2,766	-	RFQ	डेटाशीत	Bulk	0513	Active	SIP	3 (1 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
03-0518-10 CONN SOCKET SIP 3POS GOLD Aries Electronics	2,632	-	RFQ	डेटाशीत	Bulk	518	Active	SIP	3 (1 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-2513-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	3,025	-	RFQ	डेटाशीत	Bulk	Lo-PRO®file, 513	Active	DIP, 0.2 (5.08mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-3513-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	3,229	-	RFQ	डेटाशीत	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-4513-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	3,068	-	RFQ	डेटाशीत	Bulk	Lo-PRO®file, 513	Active	DIP, 0.4 (10.16mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
01-0513-11H CONN SOCKET SIP 1POS GOLD Aries Electronics	3,656	-	RFQ	डेटाशीत	Bulk	0513	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
03-0518-00 CONN SOCKET SIP 3POS GOLD Aries Electronics	3,076	-	RFQ	डेटाशीत	Bulk	518	Active	SIP	3 (1 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
01-0518-11H CONN SOCKET SIP 1POS GOLD Aries Electronics	2,411	-	RFQ	डेटाशीत	Bulk	518	Active	SIP	1 (1 x 1)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled