ICs, ट्रांजिस्टर के लिए सॉकेट

फोटो: निर्माता भाग संख्या उपलब्धता मूल्य मात्रा डेटाशीत Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
156-PRS16011-12

156-PRS16011-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,012 -

RFQ

156-PRS16011-12

डेटाशीत

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
168-PLS17011-12

168-PLS17011-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,433 -

RFQ

168-PLS17011-12

डेटाशीत

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
168-PRS17011-12

168-PRS17011-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,128 -

RFQ

168-PRS17011-12

डेटाशीत

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
172-PLS16002-12

172-PLS16002-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,343 -

RFQ

172-PLS16002-12

डेटाशीत

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
172-PRS16002-12

172-PRS16002-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,328 -

RFQ

172-PRS16002-12

डेटाशीत

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
24-3574-18

24-3574-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,612 -

RFQ

24-3574-18

डेटाशीत

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6574-18

24-6574-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,077 -

RFQ

24-6574-18

डेटाशीत

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6570-18

24-6570-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics
2,546 -

RFQ

24-6570-18

डेटाशीत

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
80-PRS21027-12

80-PRS21027-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,502 -

RFQ

80-PRS21027-12

डेटाशीत

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
175-PRS16005-12

175-PRS16005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,870 -

RFQ

175-PRS16005-12

डेटाशीत

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
28-3551-18

28-3551-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics
2,844 -

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
28-3552-18

28-3552-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics
2,612 -

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
28-3553-18

28-3553-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics
2,529 -

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
28-6551-18

28-6551-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics
2,807 -

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
28-6552-18

28-6552-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics
2,449 -

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
28-6553-18

28-6553-18

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics
3,822 -

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3554-18

28-3554-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics
3,763 -

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
132-PRS14033-12

132-PRS14033-12

PGA ZIF TEST/BURN-IN SOCKET

Aries Electronics
3,348 -

RFQ

- PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
192-PRS17027-12

192-PRS17027-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,452 -

RFQ

192-PRS17027-12

डेटाशीत

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
24-3575-18

24-3575-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,214 -

RFQ

24-3575-18

डेटाशीत

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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