और अधिक उत्पाद श्रेणियाँ

ICs, ट्रांजिस्टर के लिए सॉकेट

निर्माता भाग संख्या	उपलब्धता	मूल्य	मात्रा	डेटाशीत	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
40-3553-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	3,027	-	RFQ	डेटाशीत	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6551-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2,905	-	RFQ	डेटाशीत	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6552-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	3,442	-	RFQ	डेटाशीत	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6553-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2,496	-	RFQ	डेटाशीत	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
40-3554-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2,155	-	RFQ	डेटाशीत	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
64-9508-21 CONN IC DIP SOCKET 64POS GOLD Aries Electronics	3,285	-	RFQ	डेटाशीत	Bulk	508	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
64-9508-31 CONN IC DIP SOCKET 64POS GOLD Aries Electronics	3,963	-	RFQ	डेटाशीत	Bulk	508	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
15-PRS15068-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,241	-	RFQ	डेटाशीत	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
18-PLS15071-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,521	-	RFQ	डेटाशीत	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
18-PRS15071-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,879	-	RFQ	डेटाशीत	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
163-PGM15066-10T CONN SOCKET PGA TIN Aries Electronics	3,833	-	RFQ	डेटाशीत	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
163-PGM15067-10T CONN SOCKET PGA TIN Aries Electronics	2,528	-	RFQ	डेटाशीत	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
65-PRS10008-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,435	-	RFQ	डेटाशीत	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
65-PRS11037-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,706	-	RFQ	डेटाशीत	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
66-PLS11049-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,226	-	RFQ	डेटाशीत	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
225-PGM15001-51 CONN SOCKET PGA GOLD Aries Electronics	2,010	-	RFQ	डेटाशीत	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
66-PRS11054-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,374	-	RFQ	डेटाशीत	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
66-PLS11054-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,841	-	RFQ	डेटाशीत	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
68-PRS11033-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,884	-	RFQ		Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
68-PLS11033-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,177	-	RFQ	डेटाशीत	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)