ICs, ट्रांजिस्टर के लिए सॉकेट

फोटो: निर्माता भाग संख्या उपलब्धता मूल्य मात्रा डेटाशीत Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
30-6823-90C

30-6823-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,239 -

RFQ

30-6823-90C

डेटाशीत

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-202

28-3508-202

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,521 -

RFQ

28-3508-202

डेटाशीत

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-302

28-3508-302

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,456 -

RFQ

28-3508-302

डेटाशीत

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-202

28-6508-202

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,717 -

RFQ

28-6508-202

डेटाशीत

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-302

28-6508-302

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,216 -

RFQ

28-6508-302

डेटाशीत

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
68-PGM11032-10H

68-PGM11032-10H

CONN SOCKET PGA GOLD

Aries Electronics
3,929 -

RFQ

68-PGM11032-10H

डेटाशीत

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
68-PGM11033-10H

68-PGM11033-10H

CONN SOCKET PGA GOLD

Aries Electronics
2,998 -

RFQ

68-PGM11033-10H

डेटाशीत

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
80-PGM12015-10

80-PGM12015-10

CONN SOCKET PGA GOLD

Aries Electronics
3,331 -

RFQ

80-PGM12015-10

डेटाशीत

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-7400-10

23-7400-10

CONN SOCKET SIP 23POS TIN

Aries Electronics
2,736 -

RFQ

23-7400-10

डेटाशीत

Bulk 700 Elevator Strip-Line™ Active SIP 23 (1 x 23) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-3503-20

34-3503-20

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,478 -

RFQ

34-3503-20

डेटाशीत

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-3503-30

34-3503-30

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,181 -

RFQ

34-3503-30

डेटाशीत

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
81-PGM09001-10

81-PGM09001-10

CONN SOCKET PGA GOLD

Aries Electronics
3,472 -

RFQ

81-PGM09001-10

डेटाशीत

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C182-00

32-C182-00

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,638 -

RFQ

32-C182-00

डेटाशीत

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-00

32-C212-00

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,887 -

RFQ

32-C212-00

डेटाशीत

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-00

32-C300-00

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,522 -

RFQ

32-C300-00

डेटाशीत

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6556-10

48-6556-10

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics
2,467 -

RFQ

48-6556-10

डेटाशीत

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
19-0503-21

19-0503-21

CONN SOCKET SIP 19POS GOLD

Aries Electronics
3,337 -

RFQ

19-0503-21

डेटाशीत

Bulk 0503 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
19-0503-31

19-0503-31

CONN SOCKET SIP 19POS GOLD

Aries Electronics
2,798 -

RFQ

19-0503-31

डेटाशीत

Bulk 0503 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
36-0508-20

36-0508-20

CONN SOCKET SIP 36POS GOLD

Aries Electronics
3,977 -

RFQ

36-0508-20

डेटाशीत

Bulk 508 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
36-0508-30

36-0508-30

CONN SOCKET SIP 36POS GOLD

Aries Electronics
3,329 -

RFQ

36-0508-30

डेटाशीत

Bulk 508 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
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