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ICs, ट्रांजिस्टर के लिए सॉकेट
| फोटो: | निर्माता भाग संख्या | उपलब्धता | मूल्य | मात्रा | डेटाशीत | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICF-308-S-O-TRCONN IC DIP SOCKET 8POS TIN Samtec Inc. |
350 | - |
RFQ |
डेटाशीत |
Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
ICF-624-T-O-TR.100 SURFACE MOUNT SCREW MACHIN Samtec Inc. |
271 | - |
RFQ |
Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | |
|
1-1571552-2CONN IC DIP SOCKET 40POS TIN TE Connectivity AMP Connectors |
142 | - |
RFQ |
डेटाशीत |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
AR 28-HZL/07/7-TTCONN IC DIP SOCKET 28POS GOLD Assmann WSW Components |
1,765 | - |
RFQ |
डेटाशीत |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
816-AG11DCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
960 | - |
RFQ |
डेटाशीत |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
516-AG12D-LFCONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors |
1,173 | - |
RFQ |
डेटाशीत |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
822-AG11DCONN IC DIP SOCKET 22POS GOLD TE Connectivity AMP Connectors |
1,669 | - |
RFQ |
डेटाशीत |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
818-AG11DCONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
432 | - |
RFQ |
डेटाशीत |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
614-43-324-31-012000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
201 | - |
RFQ |
डेटाशीत |
Tube | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
1-1571994-0CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors |
118 | - |
RFQ |
डेटाशीत |
Tube | 510 | Obsolete | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester |
|
516-AG11DCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
315 | - |
RFQ |
डेटाशीत |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
816-AG10D-ESCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
909 | - |
RFQ |
डेटाशीत |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Copper Alloy | Polyester |
|
299-43-306-10-001000CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp. |
303 | - |
RFQ |
डेटाशीत |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
117-43-430-41-005000CONN IC DIP SOCKET 30POS GOLD Mill-Max Manufacturing Corp. |
143 | - |
RFQ |
डेटाशीत |
Tube | 117 | Active | DIP, 0.4 (10.16mm) Row Spacing | 30 (2 x 15) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
614-43-328-31-012000CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp. |
112 | - |
RFQ |
डेटाशीत |
Tube | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
824-AG30D-ESCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
760 | - |
RFQ |
डेटाशीत |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
299-43-318-11-001000CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp. |
197 | - |
RFQ |
डेटाशीत |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
524-AG10D-ESCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
213 | - |
RFQ |
डेटाशीत |
Tube | 500 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
540-AG11D-ESCONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
226 | - |
RFQ |
डेटाशीत |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
299-43-614-10-002000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
201 | - |
RFQ |
डेटाशीत |
Bulk | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
- 1500+ दैनिक औसत RFQ
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