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ICs, ट्रांजिस्टर के लिए सॉकेट

निर्माता भाग संख्या	उपलब्धता	मूल्य	मात्रा	डेटाशीत	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
100-008-001 CONN IC DIP SOCKET 8POS GOLD 3M	2,861	-	RFQ	डेटाशीत	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-010-000 CONN IC DIP SOCKET 10POS GOLD 3M	2,538	-	RFQ	डेटाशीत	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-014-000 CONN IC DIP SOCKET 14POS GOLD 3M	2,108	-	RFQ	डेटाशीत	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-014-001 CONN IC DIP SOCKET 14POS GOLD 3M	2,927	-	RFQ	डेटाशीत	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-016-000 CONN IC DIP SOCKET 16POS GOLD 3M	2,309	-	RFQ	डेटाशीत	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-016-001 CONN IC DIP SOCKET 16POS GOLD 3M	2,765	-	RFQ	डेटाशीत	Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-018-000 CONN IC DIP SOCKET 18POS GOLD 3M	2,897	-	RFQ		Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-018-001 CONN IC DIP SOCKET 18POS GOLD 3M	2,191	-	RFQ		Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-020-000 CONN IC DIP SOCKET 20POS GOLD 3M	2,265	-	RFQ		Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-020-001 CONN IC DIP SOCKET 20POS GOLD 3M	2,751	-	RFQ		Bulk	100	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-022-000 CONN IC DIP SOCKET 22POS GOLD 3M	2,959	-	RFQ		Bulk	100	Obsolete	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-024-000 CONN IC DIP SOCKET 24POS GOLD 3M	2,541	-	RFQ		Bulk	100	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-024-001 CONN IC DIP SOCKET 24POS GOLD 3M	3,830	-	RFQ		Bulk	100	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-028-000 CONN IC DIP SOCKET 28POS GOLD 3M	3,528	-	RFQ		Bulk	100	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-028-001 CONN IC DIP SOCKET 28POS GOLD 3M	2,149	-	RFQ		Bulk	100	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-032-000 CONN IC DIP SOCKET 32POS GOLD 3M	2,162	-	RFQ		Bulk	100	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-032-001 CONN IC DIP SOCKET 32POS GOLD 3M	2,363	-	RFQ		Bulk	100	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-040-000 CONN IC DIP SOCKET 40POS GOLD 3M	3,329	-	RFQ		Bulk	100	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-040-001 CONN IC DIP SOCKET 40POS GOLD 3M	3,558	-	RFQ		Bulk	100	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Closed Frame, Seal Tape	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled
100-042-000 CONN IC DIP SOCKET 42POS GOLD 3M	3,799	-	RFQ		Bulk	100	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled